Thinfilm Multilayer Technology for Microwave Applications

Cost reduction and increase of performance and packaging density are the main goals for development of new RF-systems. These goals can be achieved by use of thinfilm multilayer (TFML) technology suitable for applications at microwave frequencies. Within this work TFML test vehicles realized with different dielectric materials are described. The compatibility with advanced chip connection technologies is demonstrated. RF-measurements up to 40 GHz were done to characterise the technology, to evaluate the RF-behaviour of passive microwave components and to investigate the transmission behaviour of high bitrate signals. The experimental results are presented and discussed. An-outlook for applications of the technology is given.