Development of Microwave Package Characterization Technique

We present a plastic package characterization technique using coplanar waveguide to package adapter (CPA) and LRM calibrations. LRM calibrations used with off-set CPA standards are employed to de-embed the response of CPA adapters in measured S-parameters. A variety of small shrink outline packages (SSOP) has been characterized to 26.5 GHz using this technique.