3-D Micro Electro Magnetic Radio Frequency Systems (3-D MERFS) and other DARPA RF MEMS Programs

The Defense Advanced Research Projects Agency (DARPA), Microsystem Technology Office (MTO) currently sponsors a number of efforts to improve the performance of radio frequency (RF) systems using micro electromechanical systems (MEMS) technology. These include the 3-dimensional micro electromagnetic radio frequency systems (3-D MERFS), analog spectral processors (ASP), and harsh environment robust micromechanical technology (HERMIT), and micro cyrogenic coolers (MCC). In this talk, Dr. Evans provides an overview of these four efforts, focusing specifically on recent advances in the 3-D MERFS program