The development of a high performance, low cost package for MEMS Microphone package by using Lead-frame Land Grid Array (LLGA)

A new MEMS microphone package have been developed. A new technical process of LGA is utilized to meet the light, thin, short, small and high performance package. The developed leadframe based MEMS microphone can adopt SMD process, which can be applied to automatic cell phone microphone assembly process, and reduce 20% of the production cost