Integrated Smart System Solution

The worldwide trend towards miniaturization of electronic systems requires concepts, which allow a steady increase of interconnection densities on printed wiring boards (PWBs) and IC-carriers. In accordance, various patterning techniques are pushed forward to evolve design rules towards smaller conductive lines and spacings. In contrast to this continuous evolution the embedding of passive and active components into PWBs is a revolutionary change. In an immediate way, it enables designers to save valuable area on the surface of the PWB. That is, the whole system may be miniaturized providing the same functionality or new functions may be added on the space. Beyond that, embedded components are expected to show improved reliability and superior signal integrity. AT&S has investigated several approaches to integrate opto- electronic components within its PWBs. It appeared that every single component requires dedicated approaches with respect to its specific functionality. With this manuscript we provide insight into promising development paths for embedding passive and active components. Implementing these concepts can change the position that PWBs have in the current supply chain of electronic components, developing from a "dumb" interconnection solution towards an integrated smart system solution