Investigation of Micro Stress in Adhesive Bonds in Electro Optics, and Micro Optics

Micro stress in adhesive bonds was analysed and optimised for 2 examples from electro optics, and micro optics. The investigative tools were various experiments on both, model joints and real joints, finite element modelling, and validation experiments. Micro stresses were found to influence both, manufacturing quality and ageing/reliability properties