Multi Function and High Power Amplifier Chipset for X-Band Phased Array Frontends

This paper presents the design and measurement results of two MMICs for X-band phased array applications: a multi function chip (MFC) and high power amplifier (HPA). The fully integrated MFC combines the phase and attenuation setting, transmit/receive (T/R) switching, low noise amplifier and driver amplifier. Furthermore active biasing and a low-voltage CMOS compatible digital interface are included. The HPA design is matched to the MFC to create a two-chip T/R module solution and shows an excellent performance of 39.7 dBm output power with 46 % PAE at 9.0 GHz