Integrated LTCC Modules by Laminating and Co-firing Tapes Directly on Heat Sink

A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines