Novel Dual-Side Thermal Interfacing of IPM for Elevated-Temperature Applications

Novel double-side cooling for integrated power modules (IPM) is developed for elevated-temperature applications. It can reduce the p-n junction temperature rise of the power devices inside by 20% at an equivalent load, thus increasing operating ambient temperatures, which is desirable for integrated motors and elevated-temperature applications. The size and volume associated with conventional cooling mechanism can be reduced. This approach applies and improves commercially off-the-shelf products of IPM without significantly changing the original packaging design and manufacture process.