Test circuits for deep sub-micron surface acoustic wave devices

High frequency SAW devices operating at multi-GHz will be vital for future systems, such as communication systems, consumer electronics and measurement equipment. Major problems to be solved are forming low resistance thin metal films and patterning sub-micron electrodes. We have studied process conditions for high quality thin-metal-film deposition using a simple sputtering and EB deposition system, and for patterning fine electrode patterns using simple 2-layer-resist electron beam lithography. Test circuits with fine electrodes and reflective grating patterns with sizes from 0.1 um to 0.5 um are fabricated successfully