Packaging and interconnection techniques for microsystems

Microsystems require packaging and chip interconnection techniques for system integration. Electrical, optical, thermal and mechanical signal paths have to be realized. System integration techniques determine parameter interactions and signal interferences within the system. Therefore critical packaging and interconnection elements in a microsystem have to be characterized and considered in system simulation. This causes the development of new simulation and design techniques. Furthermore, precise and reproducible mounting, bonding and encapsulation techniques are important for optimized systems. The introduction of new packaging architectures has to increase the technical performance and to lower the packaging costs for microsystems. Biological models are helpful for the development of new packaging and interconnection techniques.<>