Bending and twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn solder interconnects with creep

An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the simultaneous actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience. The constitutive relationship of the 97.5Pb2.5Sn and 96.5Sn3.5Ag solder interconnects is described by the Garofalo-Arrhenius steady-state creep equation.<>