Analysis and resolution of vibration induced wire breaks in MQUAD cavity packages

Wire breaks near the second bond in MQUAD packages were found to be caused by a board depanelling process that used a high speed router. The router caused board vibrations that were transmitted to the internal cantilevered package leads. Reducing the cantilevered lead length, so that the lead resonant frequency is increased and the lead tip deflection is decreased effectively eliminates the wire breaks.<>