Frequency limitation on an assembled SO8 package

An electrical modelling and simulation concept for high speed assembly including SO8 package and integrated switch is presented. Using the Method of Moments (MoM), electrical parameters are extracted for each part of the whole assembled package, and equivalent circuits are proposed. The resulting global network is analysed using a nodal simulator such as SPICE. Isolation and insertion losses are calculated for a signal frequency up to 5 GHz. From our modelling and simulation results, the influence of the mutual coupling between strips or between the wire bondings are shown, the importance of the path connection to ground is pointed out, then required modifications of the connecting layout can be proposed. Our original concept, demonstrated on the SO8 package, is applicable on any package where the propagation effects can be neglected.<>