A novel MMIC coupler-measured and simulated data

This paper presents wafer measurements and parameter extraction on a Broadside-Offset-Coupled Coplanar-Microstrip (BOC-CPW-MS) coupler. This passive structure was fabricated by using multilayer MMIC technology which allows us to realize couplers with various coupling values, controlled by its geometry. The control of the coupling in the -3 to -30 dB range with a 100% bandwidth at 30 GHz center frequency was achieved.<>