Here today, here tomorrow: challenges of recycling engineering thermoplastics

An overview of the solid waste issue is first presented, describing the following four components of an integrated approach to solid waste management: source reduction, energy recovery, landfilling, and recycling. A review of the components of recycling is presented, including collection, separation, characterization, compounding, upgrading, and application development. Considerations for closed-loop recycling for a specific application, plastic computer housings, are discussed. Ignition-resistance polycarbonate/acrylonitrile butadiene styrene (IR PC/ABS) blend resins are commonly used in electronic enclosures. Regrind studies were conducted on laboratory test specimens and plastic computer housings manufactured from PULSE 1725, a commercial grade of IR PC/ABS. Property retention and performance results are reported.<>