Integral decoupling capacitance reduces multichip module ground bounce

A multichip module technology in which the module's power planes cover the entire module surface and are separated by 0.15- mu m of anodized aluminum (Al/sub 2/O/sub 3/) is discussed. The module provides 50 nF/cm/sup 2/ decoupling capacitance across the power supply planes with negligible series inductance. The large capacitance eliminates the need for most if not all discrete capacitors, thereby saving space, reducing delays and increasing packing density. The negligible inductance yields modules having less inductive voltage drop between power levels than any equivalent module relying on discrete decoupling capacitors.<>