Reliability evaluation of a high-density thin-film multichip module

The author describes the reliability evaluation of such a module through all phases of the program-from the early reliability prediction, through the subsequent reliability testing, to the later analysis of the field reliability performance data. He also reviews and compares the mean-time-between-failure (MTBF) design prediction goals versus the Monte Carlo simulation results, as well as the actual field-performance data over a 24-month period using various reliability assessment methods and techniques.<>