Analyzing the design-for-test techniques in a multiple substrate MCM

This paper discusses the results of several design-for-testability techniques implemented in a multichip module (MCM). MCM test issues discussed include boundary scan, Built-In-Self-Test (BIST), concurrent test sequencing, and module level test. Analyzing the results of the DFT attributes is necessary to determine effectiveness of the overall test strategy, improve upon various techniques, and learn lessons that may be carried into subsequent generations of MCM design. A discussion of the analysis and the lessons learned is presented, as well as a brief discussion on future planned implementations.<
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