Folded U-shaped micro-wire technology for GaAs IC interconnections

A novel microwire structure with folded U-shape cross section has been developed for application in GaAs IC interconnections. The structure enhances the mechanical strength and makes it possible to form an air-bridge with a 3-mm-long reach. Evaluations of the high-frequency characteristics of the wire in a transmission line reveal that this technology can be applied in microwave circuits. This technology makes it possible to transmit a microwave efficiently with a miniaturized coplanar type transmission line. This technology should prove very attractive for developing high-speed GaAs LSIs and compact monolithic microwave integrated circuits.<>