A full-wave electromagnetic model of cylindrical and conical via hole grounds for use in interactive MIC/MMIC design

An approximate yet accurate 3-D electromagnetic model of cylindrical and conical vias in microstrip is presented. The new model is formulated entirely in terms of the via physical parameters and has been verified against measured data to 40 GHz. Its extremely short execution times make it suitable for interactive CAD (computer-aided design).<>