Full-wave analysis of 3D metallization structures using a spectral domain technique

A full-wave method for the investigation of microstrip- and coplanar-structures including 3-D metallization structures is presented. The spectral domain analysis method was used to calculate the S-parameters of unshielded microwave components containing bond-wires and air-bridges. The general formulation and the method are described. The application of the theory is outlined by a comparison of measured and calculated results for a spiral inductor.<>