A technique for enhancing boiling heat transfer with application to cooling of electronic equipment

Particle layering is introduced as an effective and convenient technique for enhancing boiling nucleation on a surface. Because it can be applied without stress or damage to a surface, it can be implemented in immersion cooling, with boiling, of electronic equipment components. Such an enhanced surface, which has an increased number of nucleation sites, shows a decreased level of wall superheat under boiling and an increased critical heat flux relative to superheat and critical heat flux values for an untreated surface. Application of this technique results in a decrease of heated surface temperature and a more uniform temperature of the heated surface; both effects are important in immersion cooling of electronic equipment.<>