Modelling of the two-phase cooling of a power semiconductor and its associated evaporators

Cooling by nucleate boiling is one of the most efficient ways of removing heat from a component. A theoretical study and a model have been developed to determine heat transfer in semiconductors. Heat is removed from the semiconductor via two evaporators joining the press-pack package. The two-phase flow is evaluated inside the channels formed by the evaporators and the semiconductor. The heat transfer modeling has led to a knowledge of the semiconductor temperature evolution versus the dissipated power. The optimization of the channel shape has permitted an increase in evaporator performance.<>