High performance system-on-package integrated Yagi-Uda antennas for W-band applications and mm-wave ultra-wideband data links

This paper reports two system-on-package (SoP) integration schemes for utilizing the Yagi-Uda antenna in the RF/microwave/millimeter wave applications. A substrate independent W-band vertical Yagi-Uda was fabricated and characterized. It shows a forward gain of 5.3 dBi and a front-to-back ratio of 6 dB and has proven the feasibility of using the surface micromachining technology into SoP integration. A compact mm-wave printed Yagi array is also reported for the first time with a 12.0 dBi gain achieved