Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing

We describe low cost compatible electrical and optical flip-chip I/O interconnects to leverage the performance requirements of future high-performance chips. Metal-clad polymer pins are fabricated and assembled to demonstrate chip-to-substrate electrical and optical interconnection. In order to address the complexity of wafer-level testing, a probe substrate designed to interface with the metal-clad polymer pin I/O interconnects is fabricated and demonstrated. The demonstration of these two distinct, yet highly related, advances (novel I/O and compatible probe substrate) addresses some of the key daunting problems facing the semiconductor industry.