Characterization of SSN coupling to signal via in multi-layer PCBs and packages

The signal via is a heavily utilized interconnection structure in high-density system-on-package (SoP) substrates and PCBs. Vias facilitate complicated routings in these multilayer structures. Significant simultaneous switching noise (SSN) coupling occurs through the signal via transition when the signal via suffers return current interruption caused by reference plane exchange. The coupled SSN decreases noise and timing margins of digital and analog circuits, resulting in reduction of achievable jitter performance, bit error ratio (BER) and system reliability. We introduce a modeling method to estimate SSN coupling based on a balanced transmission line matrix (TLM) method. The proposed modeling method is successfully verified by the frequency domain measurements of several via transition structures.