Area optimization in deep sub-micron VLSI design

Area is an important factor in deep sub-micron VLSI design. In order to save die size during back-end design for our DSP microprocessor - SuperV, double metal power rings were designed, and some standard cells were also put under the horizontal power straps. In this way, more than 12% die size saved. Other optimization methods were also introduced to save area during placement and routing. Finally, the core area is shrank to 4mm /spl times/ 4mm, and the chip's area is decreased to 5mm /spl times/ 5mm including the bonding pads.