A novel low loss, thin film, WLAN antenna switching module

Thin film passives facilitate the design of reduced size components required for consumer wireless products when compared to current PCB or LTCC solutions. This paper describes the development of a low-loss, thin film process and subsequent fabrication of a WLAN antenna switch module. Parts were fabricated using both a typical Au based MMIC process and a reduced RF loss Cu process. Inductor Q was doubled and loss reduced by about .3-.4 dB for Tx and Rx channels by using the low-loss Cu process.