Low return loss DC to 60 GHz SMT package with performance verification by precision 50 Ohm load

This paper describes the design process and measurement results for a precision microstrip 50 ohm load used to qualify SMT packages with low reflection transitions up to 60 GHz. Using a low return loss 50 ohm microstrip load and a network analyzer with a time gating function allows fast and unambiguous characterization of individual package transitions. The 50 ohm load is coupled with an optimally designed wire bond connection between the microstrip circuit and the topside signal trace on the SMT package. Verification of this characterization technique is demonstrated by measurements made on a PCB /spl rarr/ package trace /spl rarr/ wire bond /spl rarr/ 50 ohm load transition, showing better than -20dB return loss DC to 50 GHz, and better than -15dB return loss DC to 60 GHz.