Thin-film multi-chip-module prototype for millimeter-waves

We have developed a thin-film multi-chip-module process suitable for integrating millimeter-wave MMICs without the use of bond-wires or flip-chip bonds. In this paper, we present the performance of our prototypes incorporating commercial MMICs and show that the method is suitable for V-band operation. To the author's knowledge, this is the first time this approach was successfully demonstrated at V-band.