The Effects of Different Parameters in Crosstalk Noise Modeling

This work uses a new model for dealing with crosstalk noise in interconnects of VLSI systems. The model considers self-inductance and mutual inductance of interconnects in 130 nm technology. The peak noise voltage is measured using HSPICE simulations. The effects of spacing, length and driver of victim line are considered. Also this work shows that for interconnects larger than 1mm; there is no need to involve self and mutual inductances in the model.