Study of MEMS packaging technology

This paper describes the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed