Processes in bulk nano-TiB/sub 2/-Cu composites under electric erosion

TiB/sub 2/-Cu nanocomposite materials were found to exhibit essentially new path of degradation under electric erosion. Porous TiB/sub 2/-enriched layer was formed on the surface and no copper melt was observed to squeeze out. Weight losses of nanocomposite material were 10 times lower compared to pure copper and arc spot size was about an order of magnitude increased. It is assumed that this particular behavior is caused by the high content of nanoparticulate inclusions and increased number of electron emission centers in nanocomposite material.