Experimental investigation of the adhesion dilation with negative thermal expansion LiAlSi/sub 2/O/sub 6/ fillers

The bonding glue is well used in packaging of the optoelectronic elements. The light paths of the elements are aligned accurately before bonding. The coefficient of thermal expansion (CTE) of bonding glue is much more larger than the one of silicon based optoelectronic elements, the light paths of the elements are thus misaligned after the bonding. The silica filler is usually mixed into the bonding glue for lowering the CTE. In this paper, the ceramic powder of the LiAlSi/sub 2/O/sub 6/ with negative CTE grating is thus mixed the commercial bonding glue for deriving of the extra low dilation adhesion. The thermal expansion of the composite bonding glue with negative CTE fillers is measured accurately to compare with the filler of silica powder. The results show that a composite glue with the very low coefficient of thermal expansion is therefore acquired for packaging of optoelectronic elements.