Complete model for interfacial stresses of a two layered structure

A model is proposed for the shearing and peeling stresses occurring at the interface of two bonded thin plates of dissimilar materials to account for differential uniform temperatures in the layers by incorporating a correction factor. The model is then upgraded to take care of the effect of linear temperature gradients in the layers by incorporating two temperature drop ratios and eventually a second correction factor. This upgraded model can be considered as a generalized form to take care of any given temperature conditions which may occur in two bonded layers. A simpler method of solution is used to develop this model which does not involve solving integro-differential equations as found in the Suhir's method. Attention is also given to observe the effect of heat generation due to the presence of a heat source in one layer (say die in electronic packaging). The results are presented for the case of die and die attach as commonly found in electronic packaging. The results are compared for Suhir and the present model.