Aluminum thermomigration technology for fabrication of silicon packages

This work researched the opportunity of application of aluminum thermomigration technology for fabrication of silicon packages. The thermomigration process is also called temperature gradient zone melting. The process was used for production of through-wafer interconnections. We describe both the process and the apparatus designed for making recrystallized doped regions during heating of a silicon wafer under a temperature gradient created along the wafer thickness. In addition, we also consider three types packages which would be possible to be made by aluminum thermomigration technology: ordinary silicon ball grid array (BGA) package, combined silicon BGA package and silicon-and-silicon BGA package.