Microlens array and micro clampers for high performance optoelectronic devices packaging

We report a new method of optoelectronic (OE) devices (e.g., vertical cavity surface emitting laser (VCSEL) and photodiode (PD)) packaging which uses an inkjet printed microlens array, self-aligning (alignment accuracies <2 /spl mu/m after final assembly) micro clampers and inkjet printed reflowed solder in micro molds for greatly improved OE devices packaging, resulting in high efficiency optical coupling (>80%) and OE interconnects.