Session 14 overview - low-power wireless and advanced integration

Low-power wireless technologies and advanced integration continue to open up new opportunities in a variety of applications. In the field of low-power wireless technologies the main challenges are the further reduction of the power and the continued system miniaturization. This session illustrates that innovative new concepts such as low power SoCs, on-chip antenna integration and more efficient rectifier ICs strongly contribute to meet these requirements. Additional challenges in the nano era include design for manufacturability of such miniaturized systems while maintaining the signal integrity. As we enter the era of ambient intelligence more electronic systems will be integrated on mechanically flexible substrates such as plastic and therefore new integration technologies need to be developed.