SE3 integration in the 3rd dimension: opportunities and challenges

While it is apparent that integrating electronic systems beyond two dimensions can potentially provide great advantages, it is less obvious what will be the most promising approaches for such integration with future technologies. The papers in this session will describe and evaluate various opportunities and challenges for vertical integration of integrated electronic systems. Cost considerations are considered prominently, as well as the potential performance improvements that can be realized. Various integration concepts will be considered for integrated systems which include digital logic, analog circuits and sensors. The session begins with a cost-based argument for 2.5D integration based on stacking of traditional 2D integrated circuits