Plasma resist image stabilization technique (PRIST)

PRIST, using a fluorocarbon plasma, effectively stabilizes the developed resist image in the production of integrated circuits. This plasma treatment, which is done at low power for a short time, allows the resist to be baked in excess of 210°C with no measurable change in dimensions. This phenomenon is attributed to the change in thermal properties of the resist surface effected by the active fluorine and fluorocarbon species generated in the plasma.