High temperature embedded power module

This new research develops the high temperature integrated power electronics module for applications involving high density, high efficiency and high environmental temperature (e.g those over 200 /spl deg/C). High temperature electronic components and proper materials to package these components are applied to the state-of-the-art technology of embedded power module, which is a hybrid MCM-based 3-D integration packaging technology developed for the integrated power electronics module application. The high temperature stress analysis and high temperature packaging technologies are further studied to develop the high temperature module. The fabrication process of this innovative high temperature embedded power module is presented and the working modules have been tested up to 250 /spl deg/C.