Bonding method of semiconductor devices on piezoelectric substrate using laser enhanced flip-chip technology

In this paper, we report new flip-chip bonding technology with laser assist, in which, semiconductor devices can be bonded on the piezoelectric substrate with small size paste bump. We formed the paste bump with nanoparticles on the piezoelectric substrate using screen printing and used the laser to locally cure the paste bump. We investigated the bonded process conditions such as laser power, heating time and electrical properties of the bump junction. The experimental results indicate the possibilities of the new bonding technology.