Reduced order models for fast time- and frequency-domain analysis of signal paths in HDI boards and packages

The paper presents a modeling concept for signal paths in generalized high density interconnect (HDI) boards and packages. It is based on partitioning the complex HDI structure into generic substructures and on subsequent application of matrix rational approximation and model order reduction methods. The modeling procedure results in reduced order models that are easily applicable to SPICE system level simulations and allow for numerically effective analysis and simulation of high-speed signal behavior in modern multilayer high density passive interconnecting structures.