1-Watt Ku-band power amplifier MMICs using low-cost quad-flat plastic package

This paper presents the performance of a 1-Watt Ku-band power amplifier MMIC in Quad Flat Plastic package (QFN) compatible with SMD assembly line. Due to the use of simple materials, it allows a significant cost reduction for RF module assembly. Depending on the QFN technology used (molded or air-cavity package), the packaged amplifier exhibits very high-gain ranging from 24- to 30 dB at Ku-band, with more than 1-Watt CW output power, under ultra-stable conditions. To the author's knowledge, this is the first paper reporting the use of such package for power devices at this frequency.