Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures [IC packaging applications]

By comparing against in-house experimental measurements, this study evaluates the numerical simulations of hygro/thermo-mechanical deformations in polymer structures commonly used in electronic packages The simulations are achieved by using the finite element method (FEM). Two different material characterization techniques are utilized for displacements and/or strains due to both moisture and thermal loading.