Analysis of critical wiring structures using CAPCAL V1.3

Two basic features of modern VLSI technology necessitate the three-dimensional (3D) solution of electrical field problems: (1) the lateral feature size is of the same order of magnitude as typical layer thicknesses; and (2) increasing layout complexity gives rise to structures for which only a genuine 3D description is applicable. The package CAPCAL V1.3 constitutes an improved version of the program introduced by A. Seidl et al. (1988). A particular extension of V1.3 is the capability for resistance calculations. As examples of the application of CAPCAL, 3D analysis of nonplanar line crossings and contact hole resistance measurement are shown.<>