Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration

A dynamic test board (DTB) is developed for shock and vibration (S&V) test. The test board is used to characterize the solder joint reliability (SJR) of the component corresponding to the specified dynamic test requirements. The dynamic behaviour and properties are investigated in the development of a flip chip ball grid array package (FCBGA). The BGA tested have 1.27, 1.09 and 1.00 mm ball pitches respectively. One of the significant findings is that board strain is correlated with the solder joint failing location. Hence, this paper introduces board strain as a predictor for S&V SJR risk and component strain limit definition in S&V conditions.