3D-signal integrity simulation and measurements on an electrical hermaphrodite connector interface

This article deals specifically with the influence of the 3D conductor overlapping in the actual contact area using a hermaphrodite contact design. With regard to the characteristic impedance profile the assembling differences between the overmolding technology of contact parts and the insert loading and assembling process is discussed. A computer simulation method is used to calculate the data of signal integrity defining the important transfer parameters of connectors in high speed applications according to the new IEC 61076-3-105 CD project which specifies 4 pair balanced, individually shielded, fixed and free connectors with characteristic impedance of 100 ohms, covering a frequency range from DC to 1500 MHz. In this context, various simulation models are presented and compared with each other. In conclusion, there is a comparison of calculations with TDR measurements (time domain reflectometry). The calculated results of the high-speed parameters are shown in various graphics and curves over the connector design, in order to define the connector signal operating range.