A new inner lead bonding scheme for tape automated bonding (TAB)

A TAB inner-lead bonding configuration consisting of bumped tape bonded to bumped die has been developed. The concept was demonstrated on an Au-Cu metallurgy in low- and high-lead-count packages. Extensive reliability investigations were performed using low-lead-count plastic packages as test vehicles. This configuration was shown to offer distinct advantages over the more conventional planar-type bumped-die bonding configuration. The bond strengths are superior, the tape to die clearance is higher, and the reliability performance is substantially better.<>